Layers counted:1-20 layers
Produces Type: HF(High Frequency)&(Radio Frequency)board,
Impedance controlled board ,BGA& Fine Pitch board,
Material:
Base Materials:FR4(Shengyi China、ITEQ)
Special Materials: Rogers, Taconic, Arlon , Nelco, Isola and so on.
Solder Mask: Nanya & Taiyo
Finished Surface: Conventional HASL, Lead-free HASL, Flash Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin, Immersion Silver, Hard Gold
Selective Surface Treatment: ENIG(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold +Gold Finger, Immersion Silver +Gold Finger, Immersion Tin +Gold Finger
Technical Specification:
Minimum Line Width/gap: 0.1mm/0.1mm
Minimum Hole Size: 0.3mm(mechanical drill)
Minimum Annular Ring: 0.1mm
Max Copper Thickness: 3 OZ
Maxproduction Size: 480×490mm
Board Thickness: D/S: 0.4 -3.5mm, Multilayers: 0.4-3.5 mm,
MinSolder Mask Bridge: ≥0.1mm
Aspect Ratio: 8:1
Plugging Vias Capability: 0.2 -0.6mm
Tolerance：
Plated Holes Tolerance: ±0.08mm
Non-Plated Hole Tolerance: ±0.05mm
Outline Tolerance: ±0.15mm
Functional Test :
Insulating Resistance : ≥50 ohms (Normality)
Peel off Strength: 1.4N/mm
Thermal Shock Test : 265℃,20 seconds
Solder Mask Hardness: ≥6H
E-Test Voltage : ≥500V+15/-0V 30S
Warp and Twist: ≤0.7% (semiconductor test board≤0.3% )
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Shearing Machines
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Drilling Machines
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Cu Plated
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